US Patent 7816171 Component packaging apparatus, systems, and methods
Patent 7816171 was granted and assigned to Intel on October, 2010 by the United States Patent and Trademark Office.
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Patent abstract
Dielectric materials comprising release agents are described. Also described are a process for improving the processability of dielectric materials during hot embossing, substrates prepared by hot embossing, and integrated-circuit packages comprising the improved substrate.
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US Patent 07816171 Component packaging apparatus, systems, and methods US Patent 7816171 Component packaging apparatus, systems, and methods
Infobox
Patent Number
0781617100
Patent Number
781617100
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
078161710
Date of Patent
October 19, 2010
0Patent Application Number
118667950
Date Filed
October 3, 2007
0Official Website
Patent Primary Examiner
Edits on 27 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
078161710
Date of Patent
October 19, 2010
0Patent Application Number
118667950
Date Filed
October 3, 2007
0Official Website
Patent Primary Examiner
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US Patent 07816171 Component packaging apparatus, systems, and methods
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07816171
Date of patent
October 19, 2010
Patent application number
11866795
Date Filed
October 3, 2007
Patent primary examiner
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