US Patent 7816171 Component packaging apparatus, systems, and methods

Patent 7816171 was granted and assigned to Intel on October, 2010 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Intel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7816171

Date of Patent

October 19, 2010

Patent Application Number

11866795

Date Filed

October 3, 2007

Patent Primary Examiner

‌

Thinh T Nguyen

Patent abstract

Dielectric materials comprising release agents are described. Also described are a process for improving the processability of dielectric materials during hot embossing, substrates prepared by hot embossing, and integrated-circuit packages comprising the improved substrate.