US Patent 7772691 Thermally enhanced wafer level package
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Patent abstract
A method of forming a package structure includes providing a plurality of dies; attaching the plurality of dies onto a heat-dissipating plate; and sawing the heat-dissipating plate into a plurality of packages, each including one of the plurality of dies and a piece of the heat-dissipating plate.
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Patent Inventor Names
Chien-Hsiun Lee0
Hsin-Hui Lee0
Mirng-Ji Lii0
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US Patent 07772691 Thermally enhanced wafer level package US Patent 7772691 Thermally enhanced wafer level package
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Patent Number
077726910
Patent Number
77726910
Edits on 18 May, 2023
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Official Website
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Patent Jurisdiction
Patent Number
077726910
Date of Patent
August 10, 2010
0Patent Application Number
118718020
Date Filed
October 12, 2007
0Official Website
Patent Primary Examiner
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US Patent 07772691 Thermally enhanced wafer level package
Infobox
Is a
Patent jurisdiction
Patent number
07772691
Date of patent
August 10, 2010
Patent application number
11871802
Date Filed
October 12, 2007
Patent primary examiner
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