Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chien-Hsiun Lee0
Mirng-Ji Lii0
Hsin-Hui Lee0
Date of Patent
August 10, 2010
0Patent Application Number
118718020
Date Filed
October 12, 2007
0Patent Primary Examiner
Patent abstract
A method of forming a package structure includes providing a plurality of dies; attaching the plurality of dies onto a heat-dissipating plate; and sawing the heat-dissipating plate into a plurality of packages, each including one of the plurality of dies and a piece of the heat-dissipating plate.
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