US Patent 7763958 Leadframe panel for power packages

Patent 7763958 was granted and assigned to National Semiconductor on July, 2010 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

National Semiconductor

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7763958

Date of Patent

July 27, 2010

Patent Application Number

11754070

Date Filed

May 25, 2007

Patent Citations Received

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US Patent 12087674 Spring bar leadframe, method and packaged electronic device with zero draft angle

Patent Primary Examiner

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Fernando L Toledo

Patent abstract

An improved leadframe panel suitable for use in packaging IC dice for use in power applications is described. The described leadframe panel enables more efficient means of encapsulation and singulation as compared with a conventional power leadframe panel. Additionally, a thin IC power package is described that enables increased package heat dissipation, the use of a larger die attach pad as well as the use of a larger die as compared with conventional power devices.