Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
July 27, 2010
Patent Application Number
11754070
Date Filed
May 25, 2007
Patent Citations Received
Patent Primary Examiner
Patent abstract
An improved leadframe panel suitable for use in packaging IC dice for use in power applications is described. The described leadframe panel enables more efficient means of encapsulation and singulation as compared with a conventional power leadframe panel. Additionally, a thin IC power package is described that enables increased package heat dissipation, the use of a larger die attach pad as well as the use of a larger die as compared with conventional power devices.
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