US Patent 7755186 Cooling solutions for die-down integrated circuit packages
Patent 7755186 was granted and assigned to Intel on July, 2010 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
December 31, 2007
Date of Patent
July 13, 2010
Patent Application Number
12006263
Patent Citations Received
Patent Inventor Names
Chia-Pin Chiu
0
Ioan Sauciuc
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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