Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chia-Pin Chiu0
Ioan Sauciuc0
Date of Patent
July 13, 2010
Patent Application Number
12006263
Date Filed
December 31, 2007
Patent Citations Received
Patent Primary Examiner
Patent abstract
Systems for cooling the backside of a semiconductor die located in a die-down integrated circuit (IC) package are described. The IC package is attached to the topside of a printed circuit board (PCB) with the backside of the die residing below the topside surface of the PCB. A cooling plate is attached to the backside of the die and thermally connected to a heat sink located above the topside surface of the PCB via conduits that pass through openings in the PCB.
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