Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Flynn Carson0
BumJoon Hong0
Jong-Woo Ha0
SeongMin Lee0
Date of Patent
July 6, 2010
Patent Application Number
12056418
Date Filed
March 27, 2008
Patent Citations Received
Patent Primary Examiner
Patent abstract
A stacked integrated circuit package system includes: providing a base integrated circuit package having a base encapsulation with a cavity therein and a base interposer exposed by the cavity; mounting an intermediate integrated circuit package over the base interposer, and mounting a top integrated circuit package over the intermediate integrated circuit package.
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