US Patent 7723617 Wired circuit board and production method thereof

Patent 7723617 was granted and assigned to Nitto Denko on May, 2010 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Nitto Denko

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

77236170

Patent Inventor Names

Yasunari Ooyabu0

Jun Ishii0

Date of Patent

May 25, 2010

Patent Application Number

118920520

Date Filed

August 20, 2007

Patent Primary Examiner

‌

Ishwarbhai B. Patel

Patent abstract

A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μm, a first insulating layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the first insulating layer.