Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yasunari Ooyabu0
Jun Ishii0
Date of Patent
May 25, 2010
0Patent Application Number
118920520
Date Filed
August 20, 2007
0Patent Primary Examiner
Patent abstract
A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μm, a first insulating layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the first insulating layer.
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