US Patent 7723617 Wired circuit board and production method thereof
Patent 7723617 was granted and assigned to Nitto Denko on May, 2010 by the United States Patent and Trademark Office.
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Patent abstract
A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μm, a first insulating layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the first insulating layer.
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Patent Inventor Names
Jun Ishii0
Yasunari Ooyabu0
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US Patent 07723617 Wired circuit board and production method thereof US Patent 7723617 Wired circuit board and production method thereof
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Patent Number
077236170
Patent Number
77236170
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
077236170
Date of Patent
May 25, 2010
0Patent Application Number
118920520
Date Filed
August 20, 2007
0Official Website
Patent Primary Examiner
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US Patent 07723617 Wired circuit board and production method thereof
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07723617
Date of patent
May 25, 2010
Patent application number
11892052
Date Filed
August 20, 2007
Patent primary examiner
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