Patent 7718345 was granted and assigned to United Microelectronics Corporation on May, 2010 by the United States Patent and Trademark Office.
A composite photoresist structure includes a first organic layer disposed over a substrate to be etched, a sacrificial layer disposed on the first organic layer, and a second organic layer disposed on the sacrificial layer. The thickness of the first organic layer and the thickness of the second organic layer are both larger than the thickness of the sacrificial layer.