US Patent 7682432 Adhesion promotion in printed circuit boards
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Patent abstract
An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.
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US Patent 07682432 Adhesion promotion in printed circuit boards US Patent 7682432 Adhesion promotion in printed circuit boards
Infobox
Patent Number
0768243200
Patent Number
768243200
Edits on 23 May, 2023
Golden AI
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Official Website
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Infobox
Is a
Patent Jurisdiction
Patent Number
076824320
Date of Patent
March 23, 2010
0Patent Application Number
117594560
Date Filed
June 7, 2007
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
076824320
Date of Patent
March 23, 2010
0Patent Application Number
117594560
Date Filed
June 7, 2007
0Official Website
Patent Primary Examiner
Edits on 18 Jun, 2022
Golden AI
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Golden AI
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US Patent 07682432 Adhesion promotion in printed circuit boards
Infobox
Is a
Patent jurisdiction
Patent number
07682432
Date of patent
March 23, 2010
Patent application number
11759456
Date Filed
June 7, 2007
Patent primary examiner
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