Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 23, 2010
Patent Application Number
11759456
Date Filed
June 7, 2007
Patent Primary Examiner
Patent abstract
An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.
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