Log in
Enquire now
‌

US Patent 7675465 Surface mountable integrated circuit packaging scheme

Patent 7675465 was granted and assigned to SiBeam on March, 2010 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
0
Current Assignee
SiBeam
SiBeam
0
Date Filed
May 22, 2007
0
Date of Patent
March 9, 2010
0
Patent Application Number
11752083
0
Patent Citations Received
‌
US Patent 12113726 Method and system for a repeater network that utilizes distributed transceivers with array processing
0
‌
US Patent 12003029 Three dimensional antenna array module
0
‌
US Patent 12010048 Method and system for a repeater network that utilizes distributed transceivers with array processing
0
‌
US Patent 12095164 Three dimensional antenna array module
0
‌
US Patent 12095165 Three dimensional antenna array module
0
‌
US Patent 11705638 Lens-enhanced communication device
0
‌
US Patent 11711113 Controlled power transmission in radio frequency (RF) device network
0
‌
US Patent 11715884 Lens-enhanced communication device
0
‌
US Patent 11715890 Wireless transceiver having receive antennas and transmit antennas with orthogonal polarizations in a phased array antenna panel
0
‌
US Patent 11757582 Method and system for a repeater network that utilizes distributed transceivers with array processing
•••
Patent Inventor Names
Mohammed Ershad Ali
0
Chinh Huy Doan
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
7675465
0
Patent Primary Examiner
‌
Huedung Mancuso
0

Find more entities like US Patent 7675465 Surface mountable integrated circuit packaging scheme

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo
By using this site, you agree to our Terms of Service.