Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Mohammed Ershad Ali0
Chinh Huy Doan0
Date of Patent
March 9, 2010
0Patent Application Number
117520830
Date Filed
May 22, 2007
0Patent Citations Received
0
...
Patent Primary Examiner
Patent abstract
An integrated circuit (IC) package is disclosed. The IC package includes a substrate having top, middle and bottom layers, an array of millimeter-wave antennas embedded on the top layer of the substrate and a monolithic microwave integrated circuit (MMIC) mounted on the bottom layer of the substrate. In one embodiment, the second level interconnect for surface-mounting on a printed circuit board (PCB) is provided on the bottom layer of the substrate.
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