US Patent 7671436 Electronic packages
Patent 7671436 was granted and assigned to Agere Systems on March, 2010 by the United States Patent and Trademark Office.
All edits
Edits on 30 Oct, 2023
Golden AI
Edits made to:
Article (+351 characters)
Article
Patent abstract
Assemblies involving integrated circuit dies (e.g. packaged integrated circuits) and packaged dies electrically connected to circuit boards at times mechanically fail at conducting pads used for electrical interconnection. Such failure is mitigated by underlying appropriate pads with a compliant region having specific characteristics.
Edits on 18 Sep, 2023
Golden AI
Edits made to:
Infobox (+5 properties)
Infobox
Patent Inventor Names
Ahmed Nur Amin0
Brian Thomas Vaccaro0
David Lee Crouthamel0
John William Osenbach0
Mark Adam Bachman0
Edits on 23 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 19 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07671436 Electronic packages US Patent 7671436 Electronic packages
Infobox
Patent Number
07671436
Patent Number
7671436
Edits on 18 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 4 Dec, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 07671436 Electronic packages
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07671436
Date of patent
March 2, 2010
Patent application number
12151108
Date Filed
May 2, 2008
Patent primary examiner
Find more entities like US Patent 7671436 Electronic packages
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.