Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Mark Adam Bachman0
Brian Thomas Vaccaro0
David Lee Crouthamel0
John William Osenbach0
Ahmed Nur Amin0
Date of Patent
March 2, 2010
Patent Application Number
12151108
Date Filed
May 2, 2008
Patent Primary Examiner
Patent abstract
Assemblies involving integrated circuit dies (e.g. packaged integrated circuits) and packaged dies electrically connected to circuit boards at times mechanically fail at conducting pads used for electrical interconnection. Such failure is mitigated by underlying appropriate pads with a compliant region having specific characteristics.
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