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US Patent 7660644 Atomic layer deposition apparatus

Patent 7660644 was granted and assigned to Applied Materials on February, 2010 by the United States Patent and Trademark Office.

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Patent abstract

A method and apparatus for atomic layer deposition (ALD) is described. The apparatus comprises a deposition chamber and a wafer support. The deposition chamber is divided into two or more deposition regions that are integrally connected one to another. The wafer support is movable between the two or more interconnected deposition regions within the deposition chamber.

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Patent Inventor Names
Alfred W. Mak0
Barry L. Chin0
Hua Chung0
Jeong Soo Byun0
Ken Kaung Lai0
Lawrence Chung-Lai Lei0
Ming Xi0
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=076606440
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US Patent 07660644 Atomic layer deposition apparatus US Patent 7660644 Atomic layer deposition apparatus

Infobox
Patent Number
076606440
Patent Number
76606440
Edits on 25 Sep, 2022
"Entity importer update"
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Golden AI
edited on 25 Sep, 2022
Infobox
Is a
Patent
Patent
0
Current Assignee
Applied Materials
Applied Materials
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
076606440
Date of Patent
February 9, 2010
0
Patent Application Number
114235350
Date Filed
June 12, 2006
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=076606440
Patent Primary Examiner
‌
Michael D Masinick
0
Edits on 18 Jun, 2022
"Entity importer update"
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edited on 18 Jun, 2022
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Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=07660644
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created this topic on 3 Dec, 2021
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 US Patent 07660644 Atomic layer deposition apparatus

Infobox
Is a
Patent
Patent
Current assignee
Applied Materials
Applied Materials
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
07660644
Date of patent
February 9, 2010
Patent application number
11423535
Date Filed
June 12, 2006
Patent primary examiner
‌
Michael D Masinick

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