US Patent 7660644 Atomic layer deposition apparatus

Patent 7660644 was granted and assigned to Applied Materials on February, 2010 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Applied Materials

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

76606440

Patent Inventor Names

Hua Chung0

Ken Kaung Lai0

Jeong Soo Byun0

Ming Xi0

Lawrence Chung-Lai Lei0

Alfred W. Mak0

Barry L. Chin0

Date of Patent

February 9, 2010

Patent Application Number

114235350

Date Filed

June 12, 2006

Patent Primary Examiner

‌

Michael D Masinick

Patent abstract

A method and apparatus for atomic layer deposition (ALD) is described. The apparatus comprises a deposition chamber and a wafer support. The deposition chamber is divided into two or more deposition regions that are integrally connected one to another. The wafer support is movable between the two or more interconnected deposition regions within the deposition chamber.