US Patent 7626278 Chip package
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Edits on 16 Sep, 2023
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Patent abstract
A chip package including a substrate, a chip and a mark is provided. The substrate has a carrying surface. A mark region is disposed on the carrying surface. The chip is disposed on the carrying surface and electrically connected to the substrate. The mark is disposed in the mark region for recording a process parameter.
Edits on 21 Jul, 2023
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US Patent 07626278 Chip package US Patent 7626278 Chip package
Infobox
Patent Number
0762627800
Patent Number
762627800
Edits on 2 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
076262780
Date of Patent
December 1, 2009
0Patent Application Number
116428920
Date Filed
December 21, 2006
0Official Website
Patent Primary Examiner
Edits on 26 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
076262780
Date of Patent
December 1, 2009
0Patent Application Number
116428920
Date Filed
December 21, 2006
0Official Website
Patent Primary Examiner
Edits on 18 Jun, 2022
Golden AI
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Golden AI
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US Patent 07626278 Chip package
Infobox
Is a
Patent jurisdiction
Patent number
07626278
Date of patent
December 1, 2009
Patent application number
11642892
Date Filed
December 21, 2006
Patent primary examiner
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