Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 1, 2009
Patent Application Number
11642892
Date Filed
December 21, 2006
Patent Primary Examiner
Patent abstract
A chip package including a substrate, a chip and a mark is provided. The substrate has a carrying surface. A mark region is disposed on the carrying surface. The chip is disposed on the carrying surface and electrically connected to the substrate. The mark is disposed in the mark region for recording a process parameter.
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