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US Patent 7621779 High-density, robust connector for stacking applications

Patent 7621779 was granted and assigned to Molex on November, 2009 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
0
Current Assignee
Molex
Molex
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Date Filed
March 31, 2006
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Date of Patent
November 24, 2009
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Patent Application Number
11395561
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Patent Citations Received
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US Patent 11996654 Controlled-impedance compliant cable termination
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US Patent 11677188 Controlled-impedance compliant cable termination
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US Patent 11688960 Routing assembly and system using same
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US Patent 11764523 Very high speed, high density electrical interconnection system with impedance control in mating region
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US Patent 11842138 Integrated routing assembly and system using same
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Patent Inventor Names
Timothy S. Elo
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Gary Humbert
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John C. Laurx
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David E. Dunham
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
7621779
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Patent Primary Examiner
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Neil Abrams
0

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