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US Patent 7621779 High-density, robust connector for stacking applications

Patent 7621779 was granted and assigned to Molex on November, 2009 by the United States Patent and Trademark Office.

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Patent abstractTimelineTable: Further ResourcesReferences
Is a
Patent
Patent
1

Patent attributes

Current Assignee
Molex
Molex
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
76217791
Patent Inventor Names
Timothy S. Elo1
Gary Humbert1
John C. Laurx1
David E. Dunham1
Date of Patent
November 24, 2009
1
Patent Application Number
113955611
Date Filed
March 31, 2006
1
Patent Citations Received
‌
US Patent 11996654 Controlled-impedance compliant cable termination
2
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US Patent 11677188 Controlled-impedance compliant cable termination
3
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US Patent 11688960 Routing assembly and system using same
4
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US Patent 11764523 Very high speed, high density electrical interconnection system with impedance control in mating region
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US Patent 11842138 Integrated routing assembly and system using same
5
Patent Primary Examiner
‌
Neil Abrams
1
Patent abstract

A high speed connector includes a plurality of terminal assemblies in which two columns of conductive terminals are supported in an insulative support body, the body including an internal cavity disposed between the two columns of conductive terminals. The terminals are arranged in horizontal pairs, and the internal cavity defines an air channel between each horizontal pair of terminals arranged in the two columns of terminals. The terminals are further aligned with each other in each row so that horizontal faces of the terminals in the two rows face each other to thereby promote broadside coupling between horizontal pairs of terminals.

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