US Patent 7616804 Wafer edge inspection and metrology
Patent 7616804 was granted and assigned to Rudolph Technologies, Inc. on November, 2009 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 22, 2006
0
Date of Patent
November 10, 2009
0
Patent Application Number
11525530
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Patent Inventor Names
Tuan D. Le
0
Ajay Pai
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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