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US Patent 7616804 Wafer edge inspection and metrology

Patent 7616804 was granted and assigned to Rudolph Technologies, Inc. on November, 2009 by the United States Patent and Trademark Office.

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Patent
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Patent attributes

Current Assignee
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Rudolph Technologies, Inc.
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
76168040
Patent Inventor Names
Tuan D. Le0
Ajay Pai0
Date of Patent
November 10, 2009
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Patent Application Number
115255300
Date Filed
September 22, 2006
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Patent Primary Examiner
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Samir A. Ahmed
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Patent abstract

Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.

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