US Patent 7597816 Wafer bevel polymer removal

Patent 7597816 was granted and assigned to Lam Research on October, 2009 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Lam Research

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7597816

Date of Patent

October 6, 2009

Patent Application Number

10934081

Date Filed

September 3, 2004

Patent Primary Examiner

‌

Anita K Alanko

Patent abstract

A method of forming a semiconductor device is provided. A wafer with a dielectric layer disposed under a photoresist mask is placed in an etch chamber. The dielectric layer is etched. The wafer is raised. A cleaning gas is provided. A plasma is formed from the cleaning gas. A polymer that has formed on the bevel of the wafer is removed using the plasma from the cleaning gas. The wafer is removed from the etch chamber.