US Patent 7589332 Via-hole processing method

Patent 7589332 was granted and assigned to Disco Corporation on September, 2009 by the United States Patent and Trademark Office.

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Patent Inventor Names

Hiroshi Morikazu0

Keiji Nomaru0

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Patent abstract

In a via-hole formation method of forming a via-hole reaching a bonding pad, in a substrate of a wafer in which a plurality of devices are formed on a surface of the substrate and the bonding pad is formed on each of the devices, a pulse laser beam whose energy distribution is shaped into a top-hat shape is emitted to form a via-hole reaching a via-hole.

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Official Website

https://pdfpiw.uspto.gov/.piw?Docid=07589332

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