US Patent 7589332 Via-hole processing method

Patent 7589332 was granted and assigned to Disco Corporation on September, 2009 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Disco Corporation

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7589332

Patent Inventor Names

Keiji Nomaru0

Hiroshi Morikazu0

Date of Patent

September 15, 2009

Patent Application Number

11900844

Date Filed

September 13, 2007

Patent Primary Examiner

‌

Bernard E Souw

Patent abstract

In a via-hole formation method of forming a via-hole reaching a bonding pad, in a substrate of a wafer in which a plurality of devices are formed on a surface of the substrate and the bonding pad is formed on each of the devices, a pulse laser beam whose energy distribution is shaped into a top-hat shape is emitted to form a via-hole reaching a via-hole.