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US Patent 7552521 Method and apparatus for improved baffle plate

Patent 7552521 was granted and assigned to Tokyo Electron on June, 2009 by the United States Patent and Trademark Office.

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Patent Citations Received
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US Patent 12112923 Reaction chamber lining
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Patent Inventor Names
Steven T. Fink0
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Patent abstract

An apparatus related to plasma chambers used for processing semiconductor substrates and specifically to improvements in pumping baffle plates used in plasma sources. An apparatus and method for making a baffle plate assembly formed from a modified baffle plate blank wherein a variety of pumping features are formed in the baffle plate blank and opened in a planar material removal operation.

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US Patent 07552521 Method and apparatus for improved baffle plate US Patent 7552521 Method and apparatus for improved baffle plate

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Patent Number
075525210
Patent Number
75525210
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=075525210
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Infobox
Is a
Patent
Patent
0
Current Assignee
Tokyo Electron
Tokyo Electron
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
075525210
Date of Patent
June 30, 2009
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Patent Application Number
110065440
Date Filed
December 8, 2004
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=075525210
Patent Primary Examiner
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Jeffrie R. Lund
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=07552521
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 US Patent 07552521 Method and apparatus for improved baffle plate

Infobox
Is a
Patent
Patent
Current assignee
Tokyo Electron
Tokyo Electron
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
07552521
Date of patent
June 30, 2009
Patent application number
11006544
Date Filed
December 8, 2004
Patent primary examiner
‌
Jeffrie R. Lund

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