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US Patent 7521789 Electrical assembly having heat sink protrusions

Patent 7521789 was granted and assigned to Rinehart Motion Systems on April, 2009 by the United States Patent and Trademark Office.

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Patent Inventor Names
Guillermo L. Romero0
Lawrence E. Rinehart0
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Patent abstract

An electrical assembly, comprising a heat producing semiconductor device supported on a first major surface of a direct bond metal substrate that has a set of heat sink protrusions supported by its second major surface. In one preferred embodiment the heat sink protrusions are made of the same metal as is used in the direct bond copper.

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US Patent 07521789 Electrical assembly having heat sink protrusions US Patent 7521789 Electrical assembly having heat sink protrusions

Infobox
Patent Number
075217890
Patent Number
75217890
Edits on 18 May, 2023
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edited on 18 May, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=075217890
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edited on 22 Sep, 2022
Infobox
Is a
Patent
Patent
0
Current Assignee
Rinehart Motion Systems
Rinehart Motion Systems
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
075217890
Date of Patent
April 21, 2009
0
Patent Application Number
110171840
Date Filed
December 18, 2004
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=075217890
Patent Primary Examiner
‌
Alexander O Williams
0
Edits on 15 Jun, 2022
"Entity importer update"
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edited on 15 Jun, 2022
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Infobox (+1 properties)
Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=07521789
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created this topic on 2 Dec, 2021
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 US Patent 07521789 Electrical assembly having heat sink protrusions

Infobox
Is a
Patent
Patent
Current assignee
Rinehart Motion Systems
Rinehart Motion Systems
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
07521789
Date of patent
April 21, 2009
Patent application number
11017184
Date Filed
December 18, 2004
Patent primary examiner
‌
Alexander O Williams

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