US Patent 7521789 Electrical assembly having heat sink protrusions

Patent 7521789 was granted and assigned to Rinehart Motion Systems on April, 2009 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Rinehart Motion Systems

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

75217890

Patent Inventor Names

Guillermo L. Romero0

Lawrence E. Rinehart0

Date of Patent

April 21, 2009

Patent Application Number

110171840

Date Filed

December 18, 2004

Patent Primary Examiner

‌

Alexander O Williams

Patent abstract

An electrical assembly, comprising a heat producing semiconductor device supported on a first major surface of a direct bond metal substrate that has a set of heat sink protrusions supported by its second major surface. In one preferred embodiment the heat sink protrusions are made of the same metal as is used in the direct bond copper.