US Patent 7517754 Methods of forming semiconductor constructions
Patent 7517754 was granted and assigned to Micron Technology on April, 2009 by the United States Patent and Trademark Office.
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Patent abstract
The invention includes methods of forming semiconductor constructions in which electrically conductive structures are formed between bitlines to electrically connect with storage node contacts. The bitlines can be formed within trenches having faceted top portions. The invention also includes semiconductor structures containing trenches with faceted top portions, and containing bitlines within the trenches.
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US Patent 07517754 Methods of forming semiconductor constructions US Patent 7517754 Methods of forming semiconductor constructions
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Patent Number
0751775400
Patent Number
751775400
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
075177540
Date of Patent
April 14, 2009
0Patent Application Number
119717470
Date Filed
January 9, 2008
0Official Website
Patent Primary Examiner
Edits on 27 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
075177540
Date of Patent
April 14, 2009
0Patent Application Number
119717470
Date Filed
January 9, 2008
0Official Website
Patent Primary Examiner
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US Patent 07517754 Methods of forming semiconductor constructions
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07517754
Date of patent
April 14, 2009
Patent application number
11971747
Date Filed
January 9, 2008
Patent primary examiner
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