US Patent 7511961 Base plate for a power semiconductor module
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Patent Inventor Names
Reinhold Bayerer0
Roman Tschirbs0
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Patent abstract
A power semiconductor module is to be pressed to a heat sink with a first surface of a first side of a base plate. To reduce the heat transfer resistance between the base plate and the heat sink, the first surface has, at least in a state, when the power semiconductor module is not pressed against the heat sink, at least one inflection point.
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US Patent 07511961 Base plate for a power semiconductor module US Patent 7511961 Base plate for a power semiconductor module
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Patent Number
075119610
Patent Number
75119610
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Official Website
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Patent Jurisdiction
Patent Number
075119610
Date of Patent
March 31, 2009
0Patent Application Number
115532480
Date Filed
October 26, 2006
0Official Website
Patent Primary Examiner
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US Patent 07511961 Base plate for a power semiconductor module
Infobox
Is a
Patent jurisdiction
Patent number
07511961
Date of patent
March 31, 2009
Patent application number
11553248
Date Filed
October 26, 2006
Patent primary examiner
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