Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Roman Tschirbs0
Reinhold Bayerer0
Date of Patent
March 31, 2009
0Patent Application Number
115532480
Date Filed
October 26, 2006
0Patent Primary Examiner
Patent abstract
A power semiconductor module is to be pressed to a heat sink with a first surface of a first side of a base plate. To reduce the heat transfer resistance between the base plate and the heat sink, the first surface has, at least in a state, when the power semiconductor module is not pressed against the heat sink, at least one inflection point.
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