US Patent 7420227 Cu-metalized compound semiconductor device
Patent 7420227 was granted and assigned to National Chiao Tung University on September, 2008 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
June 22, 2005
Date of Patent
September 2, 2008
Patent Application Number
11158070
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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