US Patent 7420227 Cu-metalized compound semiconductor device

Patent 7420227 was granted and assigned to National Chiao Tung University on September, 2008 by the United States Patent and Trademark Office.

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Current Assignee

National Chiao Tung University

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7420227

Date of Patent

September 2, 2008

Patent Application Number

11158070

Date Filed

June 22, 2005

Patent Primary Examiner

‌

Andy Huynh

Patent abstract

The present invention is a compound semiconductor device characterized in that it is Cu-metalized to improved the reliability of the device and to greatly reduce the cost of production.

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