US Patent 7413670 Method for forming wiring on a substrate
All edits
Edits on 14 Sep, 2023
Golden AI
Edits made to:
Article (+277 characters)
Article
Patent abstract
A method for forming a wiring on a substrate includes the steps of preparing a copper substrate, plating a copper-nickel layer on a portion of the copper substrate, combining the copper substrate with a soft polyimide substrate, and etching the copper substrate.
Edits on 26 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 19 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07413670 Method for forming wiring on a substrate US Patent 7413670 Method for forming wiring on a substrate
Infobox
Patent Number
0741367000
Patent Number
741367000
Edits on 3 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
074136700
Date of Patent
August 19, 2008
0Patent Application Number
108755510
Date Filed
June 25, 2004
0Official Website
Patent Primary Examiner
Edits on 24 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
074136700
Date of Patent
August 19, 2008
0Patent Application Number
108755510
Date Filed
June 25, 2004
0Official Website
Patent Primary Examiner
Edits on 9 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 1 Dec, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07413670 Method for forming wiring on a substrate
Infobox
Is a
Patent jurisdiction
Patent number
07413670
Date of patent
August 19, 2008
Patent application number
10875551
Date Filed
June 25, 2004
Patent primary examiner
Find more entities like US Patent 7413670 Method for forming wiring on a substrate
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.