Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 19, 2008
Patent Application Number
10875551
Date Filed
June 25, 2004
Patent Primary Examiner
Patent abstract
A method for forming a wiring on a substrate includes the steps of preparing a copper substrate, plating a copper-nickel layer on a portion of the copper substrate, combining the copper substrate with a soft polyimide substrate, and etching the copper substrate.
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