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US Patent 7400032 Module assembly for stacked BGA packages

Patent 7400032 was granted and assigned to Micron Technology on July, 2008 by the United States Patent and Trademark Office.

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Patent attributes

Current Assignee

Micron Technology

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Walter L. Moden0

David J. Corisis0

Larry D. Kinsman0

Leonard E. Mess0

Date of Patent

July 15, 2008

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Patent Application Number

112634260

Date Filed

October 31, 2005

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Patent Primary Examiner

Alexander Oscar Williams

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Patent abstract

Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays are disclosed. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the substantial matching of impedance for the circuits connected to the semiconductor devices.

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