US Patent 7400032 Module assembly for stacked BGA packages
Patent 7400032 was granted and assigned to Micron Technology on July, 2008 by the United States Patent and Trademark Office.
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Patent Inventor Names
David J. Corisis0
Larry D. Kinsman0
Leonard E. Mess0
Walter L. Moden0
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Patent abstract
Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays are disclosed. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the substantial matching of impedance for the circuits connected to the semiconductor devices.
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US Patent 07400032 Module assembly for stacked BGA packages US Patent 7400032 Module assembly for stacked BGA packages
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Patent Number
074000320
Patent Number
74000320
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
074000320
Date of Patent
July 15, 2008
0Patent Application Number
112634260
Date Filed
October 31, 2005
0Official Website
Patent Primary Examiner
Edits on 9 Jun, 2022
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US Patent 07400032 Module assembly for stacked BGA packages
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07400032
Date of patent
July 15, 2008
Patent application number
11263426
Date Filed
October 31, 2005
Patent primary examiner
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