US Patent 7383723 Detecting particle agglomeration in chemical mechanical polishing slurries
Patent 7383723 was granted and assigned to Intel on June, 2008 by the United States Patent and Trademark Office.
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Patent abstract
A method for detecting particle agglomeration in CMP slurries. In accordance with an implementation of the invention, a CMP slurry is tested for abrasive particle agglomeration by applying an ultra high shearing force to the slurry and analyzing its rheological behavior. Through the comparison of slurry rheological behavior, implementations of the invention make it possible to detect particle agglomeration in a slurry and to distinguish between fresh and aged slurries.
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US Patent 07383723 Detecting particle agglomeration in chemical mechanical polishing slurries US Patent 7383723 Detecting particle agglomeration in chemical mechanical polishing slurries
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Patent Number
0738372300
Patent Number
738372300
Edits on 7 Apr, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
073837230
Date of Patent
June 10, 2008
0Patent Application Number
111376740
Date Filed
May 24, 2005
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
073837230
Date of Patent
June 10, 2008
0Patent Application Number
111376740
Date Filed
May 24, 2005
0Official Website
Patent Primary Examiner
Edits on 17 Jun, 2022
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US Patent 07383723 Detecting particle agglomeration in chemical mechanical polishing slurries
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07383723
Date of patent
June 10, 2008
Patent application number
11137674
Date Filed
May 24, 2005
Patent primary examiner
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