Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ruel D R Aranda0
Shinobu Kourakata0
Karen Y. Paghasian0
Rahul N. Manepalli0
Date of Patent
February 26, 2008
0Patent Application Number
113583220
Date Filed
February 21, 2006
0Patent Primary Examiner
Patent abstract
A package includes a flexible substrate with a first region and a second region, an encapsulated die supported by the first region, and a conformable fold adhesive introduced between the encapsulated die and the flexible substrate. The second region of the flexible substrate is folded over the surface of the encapsulated die.
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