US Patent 7335973 Adhesive of folder package
Patent 7335973 was granted and assigned to Intel on February, 2008 by the United States Patent and Trademark Office.
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Patent Inventor Names
Karen Y. Paghasian0
Rahul N. Manepalli0
Ruel D R Aranda0
Shinobu Kourakata0
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Patent abstract
A package includes a flexible substrate with a first region and a second region, an encapsulated die supported by the first region, and a conformable fold adhesive introduced between the encapsulated die and the flexible substrate. The second region of the flexible substrate is folded over the surface of the encapsulated die.
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US Patent 07335973 Adhesive of folder package US Patent 7335973 Adhesive of folder package
Infobox
Patent Number
073359730
Patent Number
73359730
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
073359730
Date of Patent
February 26, 2008
0Patent Application Number
113583220
Date Filed
February 21, 2006
0Official Website
Patent Primary Examiner
Edits on 17 Jun, 2022
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US Patent 07335973 Adhesive of folder package
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07335973
Date of patent
February 26, 2008
Patent application number
11358322
Date Filed
February 21, 2006
Patent primary examiner
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