US Patent 7265048 Reduction of copper dewetting by transition metal deposition
Patent 7265048 was granted and assigned to Applied Materials on September, 2007 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
March 1, 2005
Date of Patent
September 4, 2007
Patent Application Number
11069514
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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