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US Patent 7258161 Cooling system for densely packed electronic components

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
January 16, 2004
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Date of Patent
August 21, 2007
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Patent Application Number
10759708
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Patent Citations Received
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US Patent 11943904 Hybrid thermosyphon with immersion cooled evaporator
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US Patent 11702271 Vacuum insulated articles with reflective material enhancement
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US Patent 11751930 Cryoablation element with conductive liner
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US Patent 11883085 Endovascular near critical fluid based cryoablation catheter and related methods
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US Patent 11904312 Microfluidic devices with lid for loading fluid
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Patent Inventor Names
Michael R. Cosley
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Richard L. Fischer
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
7258161
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Patent Primary Examiner
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Tho Duong
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