US Patent 7250685 Etched leadframe flipchip package system
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Patent Inventor Names
Hin Hwa Goh0
Il Kwon Shim0
Robinson Quiazon0
Sheila Marie L. Alvarez0
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Patent abstract
The present invention provides an etched leadframe flipchip package system comprising forming a leadframe comprises forming contact leads and etching a plurality of multiple dotted grooves on the contact leads, and attaching a flipchip integrated circuit having solder interconnects on the contact leads between each of the plurality of the multiple dotted grooves.
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US Patent 07250685 Etched leadframe flipchip package system US Patent 7250685 Etched leadframe flipchip package system
Infobox
Patent Number
072506850
Patent Number
72506850
Edits on 24 Sep, 2022
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Patent Jurisdiction
Patent Number
072506850
Date of Patent
July 31, 2007
0Patent Application Number
113073840
Date Filed
February 4, 2006
0Official Website
Patent Primary Examiner
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US Patent 07250685 Etched leadframe flipchip package system
Infobox
Is a
Patent jurisdiction
Patent number
07250685
Date of patent
July 31, 2007
Patent application number
11307384
Date Filed
February 4, 2006
Patent primary examiner
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