Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hin Hwa Goh0
Il Kwon Shim0
Robinson Quiazon0
Sheila Marie L. Alvarez0
Date of Patent
July 31, 2007
0Patent Application Number
113073840
Date Filed
February 4, 2006
0Patent Primary Examiner
Patent abstract
The present invention provides an etched leadframe flipchip package system comprising forming a leadframe comprises forming contact leads and etching a plurality of multiple dotted grooves on the contact leads, and attaching a flipchip integrated circuit having solder interconnects on the contact leads between each of the plurality of the multiple dotted grooves.
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