US Patent 7241678 Integrated die bumping process
Patent 7241678 was granted and assigned to United Microelectronics Corporation on July, 2007 by the United States Patent and Trademark Office.
Is a
Date Filed
January 6, 2005
0
Date of Patent
July 10, 2007
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Patent Application Number
10905490
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Patent Inventor Names
Kai-Kuang Ho
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Kuo-Ming Chen
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
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