Is a
Patent attributes
Current Assignee
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kai-Kuang Ho0
Kuo-Ming Chen0
Date of Patent
July 10, 2007
0Patent Application Number
109054900
Date Filed
January 6, 2005
0Patent Primary Examiner
Patent abstract
An integrated die bumping process includes providing a load board, defining a plurality of die regions on a surface of the load board for placing dice of a plurality of die specifications, affixing a plurality of dice respectively on the die regions according to the plurality of die specifications, and performing a die bumping process.
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